Broadcom and Samtec showcased the benefits of Co-Packaged Connectivity (CPC) at the recent DesignCon event. CPC, which aims to address bandwidth and signal integrity challenges in data centers, demonstrated successful implementation in reducing signal integrity penalties and extending reach. A white paper authored by Broadcom and Samtec highlighted the potential of CPC in high-speed I/O applications, noting its ability to eliminate losses and reflections typically found in traditional printed circuit board (PCB) and package designs. As systems scale up to support speeds like 224G-PAM4, the need to re-consider traditional design constraints becomes more pressing.
Samtec demonstrated its Si-FlyHD co-packaged cable assemblies and FlyoverOctal Small Form-factor Pluggable (OSFP) technology at OFC, highlighting the potential of CPC in improving signal integrity and reach limitations of high-speed signal routing. By incorporating Broadcom’s 200G SerDes technology, Samtec’s CPC solutions offer the industry’s highest footprint density and robust interconnect capabilities, enabling 102.4T in a compact chip substrate. The partnership between Broadcom and Samtec represents the cutting edge of CPC innovation and its potential to revolutionize high-speed data applications.
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